Hmm, I'm not so sure about A. I thought VXLAN stitching was more suited for larger-scale data center designs, but I could be wrong. Maybe we should double-check the documentation on this.
I'm leaning towards A and B being the correct answers. VXLAN stitching should work in both 3-stage and 5-stage fabrics, and it's definitely ideal for medium and large data center designs. What do you all think?
Haha, yeah, the IPIM part is a bit of a head-scratcher. Maybe the exam writers are trying to trick us with that one. But I think you guys are on the right track with B and C.
I'm a bit confused about the IPIM requirement in the underlay. Does that mean we need IP-based routing in the underlay? Seems like an odd requirement for a Layer 2 interconnect.
Yeah, I agree. VXLAN stitching is definitely more suitable for medium and large data center designs, as it allows you to connect multiple data centers seamlessly. And for Layer 2 stretched between data centers, a full mesh of VXLAN tunnels between leaf switches is required.
Hmm, this question seems to be testing our understanding of the EVPN-VXLAN stitching architecture. I'm not entirely sure about the answers, but I think B and C might be correct.
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